Plating

Technical capabilities of our plating lines include selective, control depth and brush plating. These processes provide high quality Gold, Palladium/Nickel, Nickel, Copper, Tin, and Tin/Lead electroplating.
The plating thickness is precisely controlled by PC operated fluorescent x-ray machines utilizing software that provides SPC data for each part or work order processed through our plating department.
NSP also houses its own full size chemical laboratory staffed by a resident chemist to ensure quality control of plating solutions and adherence to customer requirements and specifications. This includes, but is not limited to, wet methods of chemical analysis, atomic absorption, Hull Cell, porosity and solderability testing.
